Microchip Technology A3P250-1FGG144I

包装/外壳

FBGA-144

安装类型

表面贴装

表面安装

YES

供应商器件包装

144-FPBGA (13x13)

终端数量

144

Shipping Restrictions

This product may require additional documentation to export from the United States.

RoHS

Details

Number of I/Os

97 I/O

Supply Voltage-Min

1.425 V

Minimum Operating Temperature

- 40 C

Maximum Operating Temperature

+ 85 C

Mounting Styles

SMD/SMT

Maximum Operating Frequency

272 MHz

Moisture Sensitive

有

Factory Pack QuantityFactory Pack Quantity

160

Tradename

ProASIC3

Unit Weight

0.014110 oz

Typical Operating Supply Voltage

1.5000 V

Minimum Operating Supply Voltage

1.425 V

Maximum Operating Supply Voltage

1.575 V

Supply Voltage-Max

1.575 V

Package

Tray

Base Product Number

A3P250

厂商

微芯片技术

Product Status

活跃

Risk Rank

5.23

Ihs Manufacturer

MICROSEMI CORP

Part Life Cycle Code

活跃

Package Shape

SQUARE

Package Code

LBGA

Clock Frequency-Max

350 MHz

Manufacturer Part Number

A3P250-1FGG144I

Rohs Code

有

Operating Temperature-Max

100 °C

Reflow Temperature-Max (s)

40

Supply Voltage-Nom

1.5 V

Operating Temperature-Min

-40 °C

Package Body Material

PLASTIC/EPOXY

Moisture Sensitivity Levels

3

Package Style

GRID ARRAY, LOW PROFILE

Package Description

13X 13 MM, 1.45 MM HEIGHT, 1 MM PITCH, GREEN, FBGA-144

系列

A3P250

包装

Tray

操作温度

-40 to 85 °C

JESD-609代码

e1

端子表面处理

Tin/Silver/Copper (Sn/Ag/Cu)

HTS代码

8542.39.00.01

技术

CMOS

电压 - 供电

1.425V ~ 1.575V

端子位置

BOTTOM

终端形式

BALL

峰值回流焊温度（摄氏度）

260

端子间距

1 mm

Reach合规守则

compliant

JESD-30代码

S-PBGA-B144

资历状况

不合格

工作电源电压

1.5 V

温度等级

INDUSTRIAL

组织结构

6144 CLBS, 250000 GATES

座位高度-最大

1.55 mm

可编程逻辑类型

现场可编程门阵列

总 RAM 位数

36864

阀门数量

250000

速度等级

1

逻辑块数量

6144

等效门数

250000

高度

1.05 mm

长度

13 mm

宽度

13 mm