Microchip Technology A3P250-1PQG208

包装/外壳

PQFP-208

安装类型

表面贴装

表面安装

YES

供应商器件包装

208-PQFP (28x28)

终端数量

208

Shipping Restrictions

This product may require additional documentation to export from the United States.

RoHS

Details

Number of Logic Elements

3000 LE

Number of I/Os

151 I/O

Supply Voltage-Min

1.425 V

Minimum Operating Temperature

0 C

Maximum Operating Temperature

+ 70 C

Mounting Styles

SMD/SMT

Maximum Operating Frequency

272 MHz

Moisture Sensitive

有

Number of Logic Array Blocks - LABs

-

Factory Pack QuantityFactory Pack Quantity

24

Total Memory

36864 bit

Tradename

ProASIC3

Typical Operating Supply Voltage

1.5000 V

Supply Voltage-Max

1.575 V

Package

Tray

Base Product Number

A3P250

厂商

微芯片技术

Product Status

活跃

Risk Rank

5.24

Ihs Manufacturer

MICROSEMI CORP

Part Life Cycle Code

活跃

Package Shape

SQUARE

Package Code

FQFP

Clock Frequency-Max

350 MHz

Manufacturer Part Number

A3P250-1PQG208

Rohs Code

有

Operating Temperature-Max

85 °C

Reflow Temperature-Max (s)

40

Supply Voltage-Nom

1.5 V

Package Body Material

PLASTIC/EPOXY

Moisture Sensitivity Levels

3

Package Style

FLATPACK, FINE PITCH

Package Description

28 X 28 MM, 3.40 MM HEIGHT, 0.50 MM PITCH, GREEN, PLASTIC, QFP-208

系列

A3P250

包装

Tray

操作温度

0 to 70 °C

JESD-609代码

e3

端子表面处理

Matte Tin (Sn)

HTS代码

8542.39.00.01

技术

CMOS

电压 - 供电

1.5 V

端子位置

QUAD

终端形式

鸥翼

峰值回流焊温度（摄氏度）

245

端子间距

0.5 mm

Reach合规守则

compliant

JESD-30代码

S-PQFP-G208

资历状况

不合格

温度等级

COMMERCIAL

电流源

3 mA

组织结构

6144 CLBS, 250000 GATES

座位高度-最大

4.1 mm

可编程逻辑类型

现场可编程门阵列

总 RAM 位数

36864

阀门数量

250000

速度等级

1

逻辑块数量

6144

等效门数

250000

高度

3.4 mm

长度

28 mm

宽度

28 mm