Microchip Technology AGL1000V2-FG256

包装/外壳

FBGA

安装类型

表面贴装

表面安装

YES

供应商器件包装

256-FPBGA (17x17)

终端数量

256

Shipping Restrictions

This product may require additional documentation to export from the United States.

RoHS

N

Number of Logic Elements

11000 LE

Number of I/Os

177 I/O

Supply Voltage-Min

1.14 V

Minimum Operating Temperature

0 C

Maximum Operating Temperature

+ 70 C

Mounting Styles

SMD/SMT

Maximum Operating Frequency

526.32 MHz, 892.86 MHz

Moisture Sensitive

有

Factory Pack QuantityFactory Pack Quantity

90

Tradename

IGLOOe

Unit Weight

0.014110 oz

Typical Operating Supply Voltage

1.2, 1.5 V

Minimum Operating Supply Voltage

1.14 V

Maximum Operating Supply Voltage

1.575 V

Supply Voltage-Max

1.575 V

Package

Tray

Base Product Number

AGL1000

厂商

微芯片技术

Product Status

活跃

Package Description

BGA,

Package Style

网格排列

Moisture Sensitivity Levels

3

Package Body Material

PLASTIC/EPOXY

Supply Voltage-Nom

1.2 V

Reflow Temperature-Max (s)

30

Operating Temperature-Max

85 °C

Rohs Code

无

Manufacturer Part Number

AGL1000V2-FG256

Clock Frequency-Max

108 MHz

Package Code

BGA

Package Shape

SQUARE

Part Life Cycle Code

活跃

Ihs Manufacturer

MICROSEMI CORP

Risk Rank

5.26

系列

AGL1000V2

包装

Tray

操作温度

0 to 70 °C

JESD-609代码

e0

端子表面处理

Tin/Lead/Silver (Sn/Pb/Ag)

HTS代码

8542.39.00.01

技术

CMOS

电压 - 供电

1.14V ~ 1.575V

端子位置

BOTTOM

终端形式

BALL

峰值回流焊温度（摄氏度）

230

端子间距

1 mm

Reach合规守则

unknown

JESD-30代码

S-PBGA-B256

资历状况

不合格

工作电源电压

1.2 V to 1.5 V

温度等级

OTHER

组织结构

24576 CLBS, 1000000 GATES

座位高度-最大

1.8 mm

可编程逻辑类型

现场可编程门阵列

逻辑元件/单元数

24576

总 RAM 位数

147456

阀门数量

1000000

速度等级

STD

逻辑块数量

24576

等效门数

1000000

高度

1.2 mm

长度

17 mm

宽度

17 mm