Microchip Technology AGL250V5-FG144

包装/外壳

FBGA-144

安装类型

表面贴装

表面安装

YES

供应商器件包装

144-FPBGA (13x13)

终端数量

144

Moisture Sensitive

有

Maximum Operating Frequency

892.86 MHz

Mounting Styles

SMD/SMT

Maximum Operating Temperature

+ 70 C

Minimum Operating Temperature

0 C

Supply Voltage-Min

1.425 V

Number of I/Os

97 I/O

Number of Logic Elements

3000 LE

RoHS

N

Shipping Restrictions

This product may require additional documentation to export from the United States.

Factory Pack QuantityFactory Pack Quantity

160

Tradename

IGLOOe

Unit Weight

0.014110 oz

Typical Operating Supply Voltage

1.5000 V

Minimum Operating Supply Voltage

1.425 V

Maximum Operating Supply Voltage

1.575 V

Package

Tray

Base Product Number

AGL250

厂商

微芯片技术

Product Status

活跃

Supply Voltage-Max

1.575 V

Package Description

LBGA,

Package Style

GRID ARRAY, LOW PROFILE

Moisture Sensitivity Levels

3

Package Body Material

PLASTIC/EPOXY

Supply Voltage-Nom

1.5 V

Reflow Temperature-Max (s)

30

Operating Temperature-Max

85 °C

Rohs Code

无

Manufacturer Part Number

AGL250V5-FG144

Clock Frequency-Max

108 MHz

Package Code

LBGA

Package Shape

SQUARE

Part Life Cycle Code

活跃

Ihs Manufacturer

MICROSEMI CORP

Risk Rank

5.24

包装

Tray

系列

AGL250V5

操作温度

0 to 70 °C

JESD-609代码

e0

端子表面处理

Tin/Lead/Silver (Sn/Pb/Ag)

HTS代码

8542.39.00.01

技术

CMOS

电压 - 供电

1.5 V

端子位置

BOTTOM

终端形式

BALL

峰值回流焊温度（摄氏度）

230

端子间距

1 mm

Reach合规守则

unknown

JESD-30代码

S-PBGA-B144

资历状况

不合格

温度等级

OTHER

组织结构

6144 CLBS, 250000 GATES

座位高度-最大

1.55 mm

可编程逻辑类型

现场可编程门阵列

逻辑元件/单元数

6144

总 RAM 位数

36864

阀门数量

250000

速度等级

STD

逻辑块数量

6144

等效门数

250000

长度

13 mm

高度

1.05 mm

宽度

13 mm