参数名
参数值
参数名
参数值
包装/外壳
FBGA-256
安装类型
表面贴装
表面安装
YES
引脚数
256
供应商器件包装
256-FPBGA (17x17)
终端数量
256
RoHS
Details
Number of Logic Elements
7000 LE
Number of I/Os
177 I/O
Supply Voltage-Min
1.425 V
Minimum Operating Temperature
- 40 C
Maximum Operating Temperature
+ 100 C
Mounting Styles
SMD/SMT
Maximum Operating Frequency
892.86 MHz
Moisture Sensitive
有
Factory Pack QuantityFactory Pack Quantity
90
Tradename
IGLOOe
Unit Weight
0.014110 oz
Minimum Operating Supply Voltage
1.425 V
Maximum Operating Supply Voltage
1.575 V
Mounting
表面贴装
# Registers
13824
Programmable
有
Operating Temperature (Min.)
-40C
Operating Supply Voltage (Min)
1.425(V)
Rad Hardened
无
Operating Supply Voltage (Typ)
1.5(V)
Operating Supply Voltage (Max)
1.575(V)
Process Technology
130NM
Number of Usable Gates
600000
# I/Os (Max)
177
Operating Temp Range
-40C to 85C
Device System Gates
600000
Package Type
FBGA
Operating Temperature Classification
Industrial
Operating Temperature (Max.)
85C
Family Name
IGLOO
Package
Tray
Base Product Number
AGL600
厂商
微芯片技术
Product Status
活跃
Supply Voltage-Max
1.575 V
Risk Rank
5.25
Ihs Manufacturer
MICROSEMI CORP
Part Life Cycle Code
活跃
Package Shape
SQUARE
Package Code
BGA
Clock Frequency-Max
108 MHz
Manufacturer Part Number
AGL600V5-FGG256I
Rohs Code
有
Operating Temperature-Max
100 °C
Reflow Temperature-Max (s)
40
Supply Voltage-Nom
1.5 V
Operating Temperature-Min
-40 °C
Package Body Material
PLASTIC/EPOXY
Moisture Sensitivity Levels
3
Package Style
网格排列
Package Description
BGA,
系列
AGL600V5
包装
Tray
操作温度
-40°C ~ 85°C (TA)
JESD-609代码
e1
端子表面处理
Tin/Silver/Copper (Sn/Ag/Cu)
HTS代码
8542.39.00.01
技术
CMOS
电压 - 供电
1.5 V
端子位置
BOTTOM
终端形式
BALL
峰值回流焊温度(摄氏度)
260
端子间距
1 mm
Reach合规守则
compliant
JESD-30代码
S-PBGA-B256
资历状况
不合格
温度等级
INDUSTRIAL
数据率
-
组织结构
13824 CLBS, 600000 GATES
座位高度-最大
1.8 mm
可编程逻辑类型
现场可编程门阵列
逻辑元件/单元数
13824
总 RAM 位数
110592
阀门数量
600000
速度等级
STD
收发器数量
-
逻辑块数量
13824
等效门数
600000
高度
1.2 mm
长度
17 mm
宽度
17 mm