Microchip Technology eX256-FTQG100

包装/外壳

TQFP-100

安装类型

表面贴装

表面安装

YES

供应商器件包装

100-TQFP (14x14)

终端数量

100

RoHS

Details

Number of Logic Elements

512 LE

Number of I/Os

81 I/O

Supply Voltage-Min

2.3 V

Minimum Operating Temperature

0 C

Maximum Operating Temperature

+ 70 C

Mounting Styles

SMD/SMT

Moisture Sensitive

有

Number of Logic Array Blocks - LABs

-

Factory Pack QuantityFactory Pack Quantity

90

Tradename

Actel

Unit Weight

0.023175 oz

Family Name

eX

Operating Temperature (Max.)

70C

Operating Temperature Classification

Commercial

Package Type

TQFP

Device System Gates

12000

Operating Temp Range

0C to 70C

# I/Os (Max)

81

Number of Usable Gates

8000

Number of Logic Blocks/Elements

512

Process Technology

0.22UM

Operating Supply Voltage (Max)

2.7(V)

Operating Supply Voltage (Typ)

2.5(V)

Rad Hardened

无

Operating Supply Voltage (Min)

2.3(V)

Operating Temperature (Min.)

0C

Programmable

有

Logic Cells

512

# Registers

512

Mounting

表面贴装

Supply Voltage-Max

2.7 V

Package

Tray

Base Product Number

EX256

厂商

微芯片技术

Product Status

活跃

Package Description

LFQFP,

Package Style

FLATPACK, LOW PROFILE, FINE PITCH

Moisture Sensitivity Levels

3

Package Body Material

PLASTIC/EPOXY

Supply Voltage-Nom

2.5 V

Reflow Temperature-Max (s)

40

Operating Temperature-Max

70 °C

Rohs Code

有

Manufacturer Part Number

EX256-FTQG100

Clock Frequency-Max

178 MHz

Package Code

LFQFP

Package Shape

SQUARE

Part Life Cycle Code

活跃

Ihs Manufacturer

MICROSEMI CORP

Risk Rank

2.02

系列

eX256

包装

Tray

操作温度

0°C ~ 70°C (TA)

JESD-609代码

e3

端子表面处理

Matte Tin (Sn)

附加功能

LG-MIN; WD-MIN; TERM PITCH-MIN

HTS代码

8542.39.00.01

技术

CMOS

电压 - 供电

2.3V ~ 2.7V

端子位置

QUAD

终端形式

鸥翼

峰值回流焊温度（摄氏度）

260

端子间距

0.5 mm

Reach合规守则

compliant

引脚数量

100

JESD-30代码

S-PQFP-G100

工作电源电压

2.5 V

温度等级

COMMERCIAL

组织结构

12000 GATES

座位高度-最大

1.6 mm

可编程逻辑类型

现场可编程门阵列

逻辑元件/单元数

512

阀门数量

12000

CLB-Max的组合延时

1.4 ns

等效门数

12000

高度

1.4 mm

长度

14 mm

宽度

14 mm