Microchip Technology M1A3P1000L-FG144I

包装/外壳

FBGA

安装类型

表面贴装

表面安装

YES

供应商器件包装

144-FPBGA (13x13)

终端数量

144

RoHS

N

Number of I/Os

97 I/O

Supply Voltage-Min

1.14 V

Minimum Operating Temperature

- 40 C

Maximum Operating Temperature

+ 85 C

Mounting Styles

SMD/SMT

Maximum Operating Frequency

781.25 MHz

Moisture Sensitive

有

Factory Pack QuantityFactory Pack Quantity

160

Tradename

ProASIC3

Unit Weight

0.014110 oz

Shipping Restrictions

This product may require additional documentation to export from the United States.

Maximum Operating Supply Voltage

1.26 V

Minimum Operating Supply Voltage

1.14 V

Typical Operating Supply Voltage

1.2000 V

Supply Voltage-Max

1.26 V

Package

Tray

Base Product Number

M1A3P1000

厂商

微芯片技术

Product Status

活跃

Package Description

13 X 13 MM, 1.45 MM HEIGHT, 1 MM PITCH, FBGA-144

Package Style

GRID ARRAY, LOW PROFILE

Moisture Sensitivity Levels

3

Package Body Material

PLASTIC/EPOXY

Package Equivalence Code

BGA144,12X12,40

Operating Temperature-Min

-40 °C

Supply Voltage-Nom

1.2 V

Reflow Temperature-Max (s)

30

Operating Temperature-Max

85 °C

Rohs Code

无

Manufacturer Part Number

M1A3P1000L-FG144I

Clock Frequency-Max

350 MHz

Package Code

LBGA

Package Shape

SQUARE

Part Life Cycle Code

活跃

Ihs Manufacturer

MICROSEMI CORP

Risk Rank

5.24

系列

M1A3P1000L

包装

Tray

操作温度

-40 to 85 °C

JESD-609代码

e0

端子表面处理

Tin/Lead/Silver (Sn/Pb/Ag)

HTS代码

8542.39.00.01

技术

CMOS

电压 - 供电

1.2 V

端子位置

BOTTOM

终端形式

BALL

峰值回流焊温度（摄氏度）

225

端子间距

1 mm

Reach合规守则

compliant

JESD-30代码

S-PBGA-B144

输出的数量

97

资历状况

不合格

电源

1.5/3.3 V

温度等级

INDUSTRIAL

输入数量

97

组织结构

24576 CLBS, 1000000 GATES

座位高度-最大

1.55 mm

可编程逻辑类型

现场可编程门阵列

总 RAM 位数

147456

阀门数量

1000000

速度等级

STD

逻辑块数量

24576

逻辑单元数

24576

等效门数

1000000

高度

1.05 mm

长度

13 mm

宽度

13 mm