Microchip Technology M1A3P400-2FGG256I

包装/外壳

FPBGA-256

安装类型

表面贴装

表面安装

YES

供应商器件包装

256-FPBGA (17x17)

终端数量

256

Tradename

ProASIC3

Factory Pack QuantityFactory Pack Quantity

90

Moisture Sensitive

有

Mounting Styles

SMD/SMT

RoHS

Details

Shipping Restrictions

This product may require additional documentation to export from the United States.

Typical Operating Supply Voltage

1.5000 V

Minimum Operating Supply Voltage

1.425 V

Maximum Operating Supply Voltage

1.575 V

Number of I/Os

178

Package

Tray

Base Product Number

M1A3P400

厂商

微芯片技术

Product Status

活跃

Package Description

17 X 17 MM, 1.60 MM HEIGHT, 1 MM PITCH, GREEN, FBGA-256

Package Style

网格排列

Moisture Sensitivity Levels

3

Package Body Material

PLASTIC/EPOXY

Operating Temperature-Min

-40 °C

Supply Voltage-Nom

1.5 V

Reflow Temperature-Max (s)

40

Supply Voltage-Min

1.425 V

Operating Temperature-Max

100 °C

Rohs Code

有

Manufacturer Part Number

M1A3P400-2FGG256I

Package Code

BGA

Package Shape

SQUARE

Part Life Cycle Code

活跃

Ihs Manufacturer

MICROSEMI CORP

Supply Voltage-Max

1.575 V

Risk Rank

5.24

包装

Tray

系列

M1A3P400

操作温度

-40 to 85 °C

JESD-609代码

e1

端子表面处理

Tin/Silver/Copper (Sn/Ag/Cu)

HTS代码

8542.39.00.01

技术

CMOS

电压 - 供电

1.425V ~ 1.575V

端子位置

BOTTOM

终端形式

BALL

峰值回流焊温度（摄氏度）

260

端子间距

1 mm

Reach合规守则

compliant

JESD-30代码

S-PBGA-B256

资历状况

不合格

温度等级

INDUSTRIAL

组织结构

9216 CLBS, 400000 GATES

座位高度-最大

1.8 mm

可编程逻辑类型

现场可编程门阵列

总 RAM 位数

55296

阀门数量

400000

速度等级

STD

逻辑块数量

9216

等效门数

400000

宽度

17 mm

长度

17 mm