Microchip Technology M1A3PE3000L-1FGG896M

包装/外壳

FBGA-896

安装类型

表面贴装

表面安装

YES

供应商器件包装

896-FBGA (31x31)

终端数量

896

Unit Weight

0.014110 oz

Tradename

ProASIC3

Factory Pack QuantityFactory Pack Quantity

27

Number of Logic Array Blocks - LABs

3500 LAB

Maximum Operating Frequency

350 MHz

Distributed RAM

504 kbit

Mounting Styles

SMD/SMT

Maximum Operating Temperature

+ 125 C

Minimum Operating Temperature

- 55 C

Supply Voltage-Min

1.14 V

Number of I/Os

620 I/O

Number of Logic Elements

35000 LE

RoHS

Details

Shipping Restrictions

This product may require additional documentation to export from the United States.

Package

Tray

Base Product Number

M1A3PE3000

厂商

微芯片技术

Product Status

活跃

Supply Voltage-Max

1.575 V

Package Description

BGA, BGA896,30X30,40

Package Style

网格排列

Moisture Sensitivity Levels

3

Package Body Material

PLASTIC/EPOXY

Package Equivalence Code

BGA896,30X30,40

Operating Temperature-Min

-55 °C

Supply Voltage-Nom

1.2 V

Reflow Temperature-Max (s)

40

Operating Temperature-Max

125 °C

Rohs Code

有

Manufacturer Part Number

M1A3PE3000L-1FGG896M

Clock Frequency-Max

250 MHz

Package Code

BGA

Package Shape

SQUARE

Part Life Cycle Code

活跃

Ihs Manufacturer

MICROSEMI CORP

Risk Rank

5.3

包装

Tray

系列

M1A3PE3000L

操作温度

-55°C ~ 125°C (TJ)

JESD-609代码

e1

ECCN 代码

3A001.A.2.C

端子表面处理

Tin/Silver/Copper (Sn/Ag/Cu)

HTS代码

8542.39.00.01

技术

CMOS

电压 - 供电

1.5 V

端子位置

BOTTOM

终端形式

BALL

峰值回流焊温度（摄氏度）

250

端子间距

1 mm

Reach合规守则

compliant

JESD-30代码

S-PBGA-B896

输出的数量

620

资历状况

不合格

电源

1.2/1.5,1.2/3.3 V

温度等级

MILITARY

电流源

25 mA

数据率

700 Mb/s

输入数量

620

组织结构

75264 CLBS, 3000000 GATES

座位高度-最大

2.44 mm

可编程逻辑类型

现场可编程门阵列

总 RAM 位数

516096

阀门数量

3000000

逻辑块数量

75264

逻辑单元数

75264

等效门数

3000000

宽度

31 mm

长度

31 mm