Microchip Technology M1A3PE3000L-1FGG896M

包装/外壳

FBGA-896

安装类型

表面贴装

表面安装

YES

供应商器件包装

896-FBGA (31x31)

终端数量

896

Shipping Restrictions

This product may require additional documentation to export from the United States.

RoHS

Details

Number of Logic Elements

35000 LE

Number of I/Os

620 I/O

Supply Voltage-Min

1.14 V

Minimum Operating Temperature

- 55 C

Maximum Operating Temperature

+ 125 C

Mounting Styles

SMD/SMT

Distributed RAM

504 kbit

Maximum Operating Frequency

350 MHz

Number of Logic Array Blocks - LABs

3500 LAB

Factory Pack QuantityFactory Pack Quantity

27

Tradename

ProASIC3

Unit Weight

0.014110 oz

Package

Tray

Base Product Number

M1A3PE3000

厂商

微芯片技术

Product Status

活跃

Supply Voltage-Max

1.575 V

Package Description

BGA, BGA896,30X30,40

Package Style

网格排列

Moisture Sensitivity Levels

3

Package Body Material

PLASTIC/EPOXY

Package Equivalence Code

BGA896,30X30,40

Operating Temperature-Min

-55 °C

Supply Voltage-Nom

1.2 V

Reflow Temperature-Max (s)

40

Operating Temperature-Max

125 °C

Rohs Code

有

Manufacturer Part Number

M1A3PE3000L-1FGG896M

Clock Frequency-Max

250 MHz

Package Code

BGA

Package Shape

SQUARE

Part Life Cycle Code

活跃

Ihs Manufacturer

MICROSEMI CORP

Risk Rank

5.3

系列

M1A3PE3000L

包装

Tray

操作温度

-55°C ~ 125°C (TJ)

JESD-609代码

e1

ECCN 代码

3A001.A.2.C

端子表面处理

Tin/Silver/Copper (Sn/Ag/Cu)

HTS代码

8542.39.00.01

技术

CMOS

电压 - 供电

1.425V ~ 1.575V

端子位置

BOTTOM

终端形式

BALL

峰值回流焊温度（摄氏度）

250

端子间距

1 mm

Reach合规守则

compliant

JESD-30代码

S-PBGA-B896

输出的数量

620

资历状况

不合格

工作电源电压

1.5 V

电源

1.2/1.5,1.2/3.3 V

温度等级

MILITARY

工作电源电流

25 mA

数据率

700 Mb/s

输入数量

620

组织结构

75264 CLBS, 3000000 GATES

座位高度-最大

2.44 mm

可编程逻辑类型

现场可编程门阵列

总 RAM 位数

516096

阀门数量

3000000

逻辑块数量

75264

逻辑单元数

75264

等效门数

3000000

宽度

31 mm

长度

31 mm