Microchip Technology M2GL025-1FCSG325

包装/外壳

FCBGA-325

安装类型

表面贴装

表面安装

YES

供应商器件包装

325-FCBGA (11x11)

终端数量

325

Shipping Restrictions

This product may require additional documentation to export from the United States.

RoHS

Details

Number of Logic Elements

27696 LE

Number of I/Os

180 I/O

Supply Voltage-Min

1.2 V

Minimum Operating Temperature

0 C

Maximum Operating Temperature

+ 85 C

Mounting Styles

SMD/SMT

Moisture Sensitive

有

Factory Pack QuantityFactory Pack Quantity

176

Tradename

IGLOO2

Supply Voltage-Max

1.2 V

Package

Tray

Base Product Number

M2GL025

厂商

微芯片技术

Product Status

活跃

Package Description

BGA, BGA325,21X21,20

Package Style

网格排列

Moisture Sensitivity Levels

3

Package Body Material

PLASTIC/EPOXY

Package Equivalence Code

BGA325,21X21,20

Supply Voltage-Nom

1.2 V

Reflow Temperature-Max (s)

30

Operating Temperature-Max

85 °C

Rohs Code

有

Manufacturer Part Number

M2GL025-1FCSG325

Package Code

BGA

Package Shape

SQUARE

Part Life Cycle Code

活跃

Ihs Manufacturer

MICROSEMI CORP

Risk Rank

5.27

系列

M2GL025

包装

Tray

操作温度

0°C ~ 85°C (TJ)

HTS代码

8542.39.00.01

技术

CMOS

电压 - 供电

1.14V ~ 2.625V

端子位置

BOTTOM

终端形式

BALL

峰值回流焊温度（摄氏度）

260

Reach合规守则

compliant

JESD-30代码

S-PBGA-B325

输出的数量

180

资历状况

不合格

工作电源电压

1.2 V

电源

1.2 V

温度等级

OTHER

输入数量

180

可编程逻辑类型

现场可编程门阵列

逻辑元件/单元数

27696

总 RAM 位数

1130496

逻辑单元数

27696