Microchip Technology M2GL150-1FCV484I

包装/外壳

484-BFBGA

安装类型

表面贴装

表面安装

YES

供应商器件包装

484-FBGA (19x19)

终端数量

484

Shipping Restrictions

This product may require additional documentation to export from the United States.

RoHS

N

Moisture Sensitive

有

Factory Pack QuantityFactory Pack Quantity

84

Tradename

IGLOO2

Number of I/Os

248

Package

Tray

Base Product Number

M2GL150

厂商

微芯片技术

Product Status

活跃

Package Description

FBGA,

Package Style

GRID ARRAY, FINE PITCH

Package Body Material

PLASTIC/EPOXY

Supply Voltage-Nom

1.2 V

Reflow Temperature-Max (s)

20

Supply Voltage-Min

1.14 V

Rohs Code

无

Manufacturer Part Number

M2GL150-1FCV484I

Package Code

FBGA

Package Shape

SQUARE

Part Life Cycle Code

活跃

Ihs Manufacturer

MICROSEMI CORP

Supply Voltage-Max

1.26 V

Risk Rank

5.27

系列

M2GL150

包装

Tray

操作温度

-40°C ~ 100°C (TJ)

HTS代码

8542.39.00.01

电压 - 供电

1.14V ~ 2.625V

端子位置

BOTTOM

终端形式

BALL

峰值回流焊温度（摄氏度）

240

端子间距

0.8 mm

Reach合规守则

compliant

JESD-30代码

S-PBGA-B484

座位高度-最大

3.15 mm

可编程逻辑类型

现场可编程门阵列

逻辑元件/单元数

146124

总 RAM 位数

5120000

宽度

19 mm

长度

19 mm