Microchip Technology M2S005S-1FGG484T2

包装/外壳

BGA-484

供应商器件包装

484-FPBGA (23x23)

Shipping Restrictions

This product may require additional documentation to export from the United States.

RoHS

Details

Mounting Styles

SMD/SMT

Core

ARM Cortex M3

Maximum Clock Frequency

166 MHz

L1 Cache Instruction Memory

-

L1 Cache Data Memory

-

Data RAM Size

64 kB

Number of Logic Elements

6060 LE

Number of I/Os

209 I/O

Minimum Operating Temperature

0 C

Maximum Operating Temperature

+ 85 C

Distributed RAM

191 kbit

Moisture Sensitive

有

Number of Logic Array Blocks - LABs

505 LAB

Factory Pack QuantityFactory Pack Quantity

60

Typical Operating Supply Voltage

1.2000 V

Product Status

活跃

厂商

微芯片技术

Base Product Number

M2S005

Package

Tray

Package Description

,

Reflow Temperature-Max (s)

40

Rohs Code

有

Manufacturer Part Number

M2S005S-1FGG484T2

Part Life Cycle Code

活跃

Ihs Manufacturer

MICROSEMI CORP

Risk Rank

5.81

包装

Tray

系列

SmartFusion2

操作温度

0 to 85 °C

JESD-609代码

e1

无铅代码

有

端子表面处理

Tin/Silver/Copper (Sn/Ag/Cu)

峰值回流焊温度（摄氏度）

250

Reach合规守则

compliant

工作电源电压

1.2 V

速度

166MHz

内存大小

64KB

核心处理器

ARM® Cortex®-M3

周边设备

DDR

程序内存大小

128 kB

连接方式

CANbus, Ethernet, I²C, SPI, UART/USART, USB

建筑学

MCU, FPGA

可编程逻辑类型

现场可编程门阵列

速度等级

1

主要属性

FPGA - 5K Logic Modules

核数量

1 Core

闪光大小

128KB