参数名
参数值
参数名
参数值
包装/外壳
Die
供应商器件包装
Die
ECCN (US)
EAR99
HTS
8542.33.00.01
Manufacturer Type
MMIC 放大器
Number of Channels per Chip
1
Maximum Operating Frequency (MHz)
26000
Typical Gain Flatness (dB)
±0.25
Typical Power Gain (dB)
18@20000MHz
Typical Output Power (dBm)
20@20000MHz
Typical Output Intercept Point (dBm)
36@20000MHz
Maximum Input Return Loss (dB)
20(Typ)@20000MHz
Maximum Output Return Loss (dB)
16(Typ)@20000MHz
Maximum Operating Supply Voltage (V)
8
Maximum Single Supply Voltage (V)
8
Maximum Supply Current (mA)
150(Typ)@7V
Maximum Power Dissipation (mW)
2400
Minimum Operating Temperature (°C)
-55
Maximum Operating Temperature (°C)
85
Supplier Package
Die
Package Height
0.1
Package Length
3
Package Width
1.3
PCB changed
14
Pd - Power Dissipation
2.4 W
Maximum Operating Temperature
+ 85 C
Minimum Operating Temperature
- 55 C
Factory Pack QuantityFactory Pack Quantity
1
Mounting Styles
SMD/SMT
NF - Noise Figure
3.2 dB
P1dB - Compression Point
20 dBm
Input Return Loss
20 dB
Manufacturer
Microchip
Brand
Microchip Technology / Atmel
OIP3 - Third Order Intercept
34 dBm
RoHS
Details
Package
Tray
Base Product Number
MMA041
厂商
微芯片技术
Product Status
活跃
包装
Waffle
系列
-
零件状态
活跃
类型
低噪声放大器
子类别
Wireless & RF Integrated Circuits
技术
GaAs
电压 - 供电
7V
频率
0Hz ~ 26GHz
引脚数量
14
工作频率
0 Hz to 26 GHz
工作电源电压
7 V
通道数量
1 Channel
测试频率
12 GHz to 20 GHz
电流源
150 mA
产品类别
射频放大器
增益
18 dB
射频类型
通用型
噪声图
2.5dB
P1dB
22.5dBm
电源类型
Single
产品类别
射频放大器
RoHS状态
符合RoHS标准