Micron MT47H512M8THM-3:A

表面安装

YES

终端数量

63

Package Description

FBGA, BGA63,9X11,32

Package Style

GRID ARRAY, FINE PITCH

Number of Words Code

512000000

Package Body Material

PLASTIC/EPOXY

Package Equivalence Code

BGA63,9X11,32

Operating Temperature-Max

85 °C

Rohs Code

有

Manufacturer Part Number

MT47H512M8THM-3:A

Number of Words

536870912 words

Supply Voltage-Nom (Vsup)

1.8 V

Package Code

FBGA

Package Shape

RECTANGULAR

Manufacturer

Micron Technology Inc

Part Life Cycle Code

Obsolete

Ihs Manufacturer

MICRON TECHNOLOGY INC

Risk Rank

5.82

子类别

DRAMs

技术

CMOS

端子位置

BOTTOM

终端形式

BALL

端子间距

0.8 mm

Reach合规守则

unknown

JESD-30代码

R-PBGA-B63

资历状况

不合格

电源

1.8 V

温度等级

OTHER

电源电流-最大值

0.353 mA

组织结构

512MX8

输出特性

3-STATE

内存宽度

8

待机电流-最大值

0.016 A

记忆密度

4294967296 bit

I/O类型

COMMON

内存IC类型

DDR DRAM

刷新周期

8192