Micron NAND64GAH0HZA5E

表面安装

YES

终端数量

169

Manufacturer Part Number

NAND64GAH0HZA5E

Rohs Code

有

Part Life Cycle Code

活跃

Ihs Manufacturer

MICRON TECHNOLOGY INC

Risk Rank

5.29

Operating Temperature-Max

85 °C

Operating Temperature-Min

-25 °C

Package Body Material

PLASTIC/EPOXY

Package Code

FBGA

Package Equivalence Code

BGA169,14X28,20

Package Shape

RECTANGULAR

Package Style

GRID ARRAY, FINE PITCH

端子位置

BOTTOM

终端形式

BALL

端子间距

0.5 mm

Reach合规守则

compliant

JESD-30代码

R-PBGA-B169

资历状况

不合格

电源

1.8/3.3,3.3 V

温度等级

OTHER

电源电流-最大值

0.15 mA

记忆密度

8589934592 bit