Micron NAND99W3M1BZBC5F

表面安装

YES

终端数量

137

Manufacturer Part Number

NAND99W3M1BZBC5F

Rohs Code

有

Part Life Cycle Code

Obsolete

Ihs Manufacturer

MICRON TECHNOLOGY INC

Package Description

FBGA, BGA137,10X15,32

Risk Rank

5.84

Operating Temperature-Max

85 °C

Operating Temperature-Min

-30 °C

Supply Voltage-Nom (Vsup)

3 V

Package Style

GRID ARRAY, FINE PITCH

Package Shape

RECTANGULAR

Package Equivalence Code

BGA137,10X15,32

Package Code

FBGA

Package Body Material

PLASTIC/EPOXY

端子位置

BOTTOM

终端形式

BALL

端子间距

0.8 mm

Reach合规守则

compliant

JESD-30代码

R-PBGA-B137

资历状况

不合格

电源

3 V

温度等级

OTHER

内存IC类型

存储器电路

混合内存类型

FLASH+SDRAM