Micron Technology MT18HTF25672FDY-667G1D6

ECCN (US)

EAR99

Module

DRAM模块

Module Density

2Gbyte

Number of Chip per Module

18

Chip Density (bit)

1G

Data Bus Width (bit)

72

Maximum Clock Rate (MHz)

667

Chip Configuration

128Mx8

Minimum Operating Supply Voltage (V)

1.7

Typical Operating Supply Voltage (V)

1.8

Maximum Operating Supply Voltage (V)

1.9

Minimum Operating Temperature (°C)

0

Maximum Operating Temperature (°C)

95

Module Sides

Double

ECC Support

有

Number of Ranks

Dual

Number of Chip Banks

8

CAS Latency

5

PC Type

PC2-5300

SPD EEPROM Support

有

Standard Package Name

DIM

Supplier Package

FBDIMM

Mounting

Socket

Package Height

30.5(Max)

Package Length

133.5(Max)

Package Width

7.68(Max)

PCB changed

240

Lead Shape

No Lead

包装

Tray

零件状态

Obsolete

引脚数量

240

组织结构

256Mx72

锁相环

无

刷新周期

8K

自我刷新

无

模块类型

240FBDIMM

RoHS状态

是,有豁免