Micron Technology MT18LSDT1672AG-10EG8
- 收藏
- 对比
MT18LSDT1672AG-10EG8
1616-MT18LSDT1672AG-10EG8
存储器 - 模块
--
大陆
立即发货

MT18LSDT1672AG-10EG8 datasheet pdf and Memory - Modules product details from Micron Technology stock available at utmel
1最小包装量--
MT18LSDT1672AG-10EG8详情
Micron Technology MT18LSDT1672AG-10EG8重要参数规格及、参数值,及相似型号如下:
- 参数名参数值全选
- 参数名参数值全选
EU RoHS
不合规
ECCN (US)
EAR99
Automotive
无
PPAP
无
Module
DRAM模块
Module Density
128Mbyte
Number of Chip per Module
18
Chip Density (bit)
64M
Data Bus Width (bit)
72
Max. Access Time (ns)
6
Maximum Clock Rate (MHz)
100
Chip Configuration
8Mx8
Minimum Operating Supply Voltage (V)
3
Typical Operating Supply Voltage (V)
3.3
Maximum Operating Supply Voltage (V)
3.6
Operating Current (mA)
1098
Minimum Operating Temperature (°C)
0
Maximum Operating Temperature (°C)
65
Supplier Temperature Grade
Commercial
Module Sides
Double
ECC Support
有
Number of Ranks
Dual
Number of Chip Banks
4
CAS Latency
2
PC Type
PC-100
SPD EEPROM Support
有
Mounting
Socket
Package Height
35.08(Max)
Package Width
3.99(Max)
Package Length
133.5(Max)
PCB changed
168
Supplier Package
UDIMM
Lead Shape
No Lead
包装
Tray
零件状态
Obsolete
引脚数量
168
组织结构
16Mx72
锁相环
无
刷新周期
4K
自我刷新
有
模块类型
168UDIMM
MT18LSDT1672AG-10EG8拓展信息
Micron Technology Inc.
Micron Technology Inc.
Micron Technology Inc.
Micron Technology Inc.
Micron Technology Inc.
Micron Technology Inc.
Micron Technology Inc.
Micron Technology Inc.
Micron Technology Inc.
Micron Technology Inc.







哦! 它是空的。