Micron Technology MT4HTF6464HY-53EE1

ECCN (US)

EAR99

Module

DRAM模块

Module Density

512Mbyte

Number of Chip per Module

4

Chip Density (bit)

1G

Data Bus Width (bit)

64

Maximum Clock Rate (MHz)

533

Chip Configuration

64Mx16

Minimum Operating Supply Voltage (V)

1.7

Typical Operating Supply Voltage (V)

1.8

Maximum Operating Supply Voltage (V)

1.9

Operating Current (mA)

720

Minimum Operating Temperature (°C)

0

Maximum Operating Temperature (°C)

70

Supplier Temperature Grade

Commercial

Module Sides

Single

ECC Support

无

Number of Ranks

Single

Number of Chip Banks

8

CAS Latency

4

PC Type

PC2-4200

SPD EEPROM Support

有

Standard Package Name

DIM

Supplier Package

SODIMM

Mounting

Socket

Package Height

30(Max)

Package Length

67.75(Max)

Package Width

2.45(Max)

PCB changed

200

Lead Shape

No Lead

包装

Tray

零件状态

Obsolete

引脚数量

200

组织结构

64Mx64

锁相环

无

刷新周期

8K

自我刷新

有

模块类型

200SODIMM

RoHS状态

是,有豁免