Micron Technology MT8KTF51264HZ-1G6J1

底架

Socket

引脚数

204

Package Width

3.8(Max)

PCB changed

204

Lead Shape

No Lead

ECCN (US)

EAR99

Module

DRAM模块

Module Density

4Gbyte

Number of Chip per Module

8

Chip Density (bit)

4G

Data Bus Width (bit)

64

Maximum Clock Rate (MHz)

1600

Chip Configuration

512Mx8

Minimum Operating Supply Voltage (V)

1.283/1.425

Typical Operating Supply Voltage (V)

1.35/1.5

Maximum Operating Supply Voltage (V)

1.45/1.575

Operating Current (mA)

1256

Minimum Operating Temperature (°C)

0

Maximum Operating Temperature (°C)

70

Supplier Temperature Grade

Commercial

Module Sides

Double

ECC Support

无

Number of Ranks

Single

Number of Chip Banks

8

CAS Latency

11

PC Type

PC3-12800

SPD EEPROM Support

有

Standard Package Name

DIM

Supplier Package

SODIMM

Mounting

Socket

Package Height

30.15(Max)

Package Length

67.75(Max)

Number of Elements

8

RoHS

Compliant

零件状态

Obsolete

最高工作温度

70 °C

最小工作温度

0 °C

引脚数量

204

组织结构

512Mx64

最高频率

1.6 GHz

锁相环

无

刷新周期

8K

自我刷新

有

模块类型

204SODIMM

RoHS状态

是,有豁免