Micron Technology MT8LSDT3264AG-13ED2

ECCN (US)

EAR99

HTS

8542.32.00.28

Module

DRAM模块

Module Density

256Mbyte

Number of Chip per Module

8

Chip Density (bit)

256M

Data Bus Width (bit)

64

Max. Access Time (ns)

5.4

Maximum Clock Rate (MHz)

133

Chip Configuration

32Mx8

Minimum Operating Supply Voltage (V)

3

Typical Operating Supply Voltage (V)

3.3

Maximum Operating Supply Voltage (V)

3.6

Operating Current (mA)

1080

Minimum Operating Temperature (°C)

0

Maximum Operating Temperature (°C)

70

Supplier Temperature Grade

Commercial

Module Sides

Single

ECC Support

无

Number of Ranks

Single

Number of Chip Banks

4

CAS Latency

2

PC Type

PC-133

SPD EEPROM Support

有

Standard Package Name

DIM

Supplier Package

UDIMM

Mounting

Socket

Package Height

28.73(Max)

Package Length

133.5(Max)

Package Width

3.99(Max)

PCB changed

168

Lead Shape

No Lead

零件状态

Obsolete

引脚数量

168

组织结构

32Mx64

锁相环

无

刷新周期

8K

自我刷新

有

模块类型

168UDIMM

RoHS状态

RoHS non-compliant