Micron Technology MT8MTF51264HRZ-1G6E2

ECCN (US)

EAR99

Module

DRAM模块

Module Density

4Gbyte

Lead Shape

No Lead

PCB changed

204

Package Width

2.45(Max)

Package Length

67.75(Max)

Package Height

30.15(Max)

Mounting

Socket

Supplier Package

SODIMM

Standard Package Name

DIM

SPD EEPROM Support

有

PC Type

PC3-12800

CAS Latency

11

Number of Chip Banks

8

Number of Ranks

Single

ECC Support

无

Module Sides

Single

Supplier Temperature Grade

Commercial

Maximum Operating Temperature (°C)

70

Minimum Operating Temperature (°C)

0

Operating Current (mA)

1192

Maximum Operating Supply Voltage (V)

1.45/1.575

Typical Operating Supply Voltage (V)

1.35/1.5

Minimum Operating Supply Voltage (V)

1.283/1.425

Chip Configuration

512Mx8

Maximum Clock Rate (MHz)

1600

Data Bus Width (bit)

64

Chip Density (bit)

4G

Number of Chip per Module

8

零件状态

Obsolete

引脚数量

204

组织结构

512Mx64

锁相环

无

刷新周期

8K

自我刷新

有

模块类型

204SODIMM

RoHS状态

是,有豁免