Micron Technology MT8VDDT3264AG-40BGB

ECCN (US)

EAR99

Module

DRAM模块

Module Density

256Mbyte

Number of Chip per Module

8

Chip Density (bit)

256M

Data Bus Width (bit)

64

Maximum Clock Rate (MHz)

400

Chip Configuration

32Mx8

Minimum Operating Supply Voltage (V)

2.5

Typical Operating Supply Voltage (V)

2.6

Maximum Operating Supply Voltage (V)

2.7

Operating Current (mA)

1600

Minimum Operating Temperature (°C)

0

Maximum Operating Temperature (°C)

70

Supplier Temperature Grade

Commercial

ECC Support

无

Number of Ranks

Single

CAS Latency

3

Standard Package Name

DIM

Supplier Package

UDIMM

Mounting

Socket

Package Height

28.7(Max)

Package Length

133.5(Max)

Package Width

3.18(Max)

PCB changed

184

Lead Shape

No Lead

包装

Tray

零件状态

Obsolete

引脚数量

184

组织结构

32Mx64

模块类型

184UDIMM

RoHS状态

RoHS non-compliant