Micron Technology MT8VDDT6464HIY-335F3

ECCN (US)

4A994.a

Module

DRAM模块

Module Density

512Mbyte

Number of Chip per Module

8

Chip Density (bit)

512M

Data Bus Width (bit)

64

Maximum Clock Rate (MHz)

333

Chip Configuration

64Mx8

Minimum Operating Supply Voltage (V)

2.3

Typical Operating Supply Voltage (V)

2.5

Maximum Operating Supply Voltage (V)

2.7

Operating Current (mA)

1400

Minimum Operating Temperature (°C)

-40

Maximum Operating Temperature (°C)

85

Supplier Temperature Grade

Industrial

ECC Support

无

Number of Ranks

Single

CAS Latency

2.5

Standard Package Name

DIM

Supplier Package

SODIMM

Mounting

Socket

Package Height

31.9(Max)

Package Length

67.75(Max)

Package Width

3.8(Max)

PCB changed

200

Lead Shape

No Lead

包装

Tray

零件状态

Obsolete

引脚数量

200

组织结构

64Mx64

模块类型

200SODIMM

RoHS状态

是,有豁免