Micron Technology MT9HTF12872PY-667E1

ECCN (US)

EAR99

Module

DRAM模块

Module Density

1Gbyte

Number of Chip per Module

9

Chip Density (bit)

1G

Data Bus Width (bit)

72

Max. Access Time (ns)

0.045

Maximum Clock Rate (MHz)

667

Chip Configuration

128Mx8

Minimum Operating Supply Voltage (V)

1.7

Typical Operating Supply Voltage (V)

1.8

Maximum Operating Supply Voltage (V)

1.9

Operating Current (mA)

1215

Minimum Operating Temperature (°C)

0

Maximum Operating Temperature (°C)

55

Module Sides

Double

ECC Support

有

Number of Ranks

Single

Number of Chip Banks

8

CAS Latency

5

PC Type

PC2-5300

SPD EEPROM Support

有

Standard Package Name

DIM

Supplier Package

Mini-RDIMM

Mounting

Socket

Package Height

30.1(Max)

Package Length

82.13(Max)

Package Width

3.8(Max)

PCB changed

244

Lead Shape

No Lead

包装

Tray

零件状态

Obsolete

引脚数量

244

组织结构

128Mx72

锁相环

有

刷新周期

8K

自我刷新

有

模块类型

244RDIMM

RoHS状态

符合RoHS标准