Micron Technology MT9HTF3272AY-53EB3

ECCN (US)

4A994.a

Module

DRAM模块

Module Density

256Mbyte

Number of Chip per Module

9

Chip Density (bit)

256M

Data Bus Width (bit)

72

Max. Access Time (ns)

0.05

Maximum Clock Rate (MHz)

533

Chip Configuration

32Mx8

Minimum Operating Supply Voltage (V)

1.7

Typical Operating Supply Voltage (V)

1.8

Maximum Operating Supply Voltage (V)

1.9

Operating Current (mA)

1440

Minimum Operating Temperature (°C)

0

Maximum Operating Temperature (°C)

85

Supplier Temperature Grade

Commercial

ECC Support

有

Number of Ranks

Single

CAS Latency

4

Standard Package Name

DIM

Supplier Package

UDIMM

Mounting

Socket

Package Height

30.5(Max)

Package Length

133.5(Max)

Package Width

2.7(Max)

PCB changed

240

Lead Shape

No Lead

包装

Tray

零件状态

Obsolete

引脚数量

240

组织结构

32Mx72

模块类型

240UDIMM

RoHS状态

是,有豁免