Microsemi MSM096BM2L-M00I

表面安装

YES

终端数量

524

Manufacturer Part Number

MSM096BM2L-M00I

Part Life Cycle Code

Obsolete

Ihs Manufacturer

MICROSEMI CORP

Package Description

32 X 28 MM, PLASTIC, BGA-524

Risk Rank

5.73

Operating Temperature-Max

85 °C

Operating Temperature-Min

-40 °C

Package Body Material

PLASTIC/EPOXY

Package Code

BGA

Package Shape

RECTANGULAR

Package Style

网格排列

Supply Voltage-Max

5.5 V

Supply Voltage-Min

3.14 V

Supply Voltage-Nom

3.3 V

附加功能

SEATED HT-CALCULATED

HTS代码

8542.31.00.01

端子位置

BOTTOM

终端形式

BALL

端子间距

1 mm

Reach合规守则

unknown

JESD-30代码

R-PBGA-B524

温度等级

INDUSTRIAL

uPs/uCs/外围ICs类型

SECONDARY STORAGE CONTROLLER, FLASH MEMORY DRIVE

座位高度-最大

6.1 mm

最大数据传输率

375 MBps

主机数据传输速率-最大

179 MBps

长度

32 mm

宽度

28 mm