Microsemi W3H32M72E-667SBM

表面安装

YES

终端数量

208

Manufacturer Part Number

W3H32M72E-667SBM

Part Life Cycle Code

Obsolete

Ihs Manufacturer

MICROSEMI CORP

Package Description

BGA, BGA208,11X19,40

Risk Rank

5.82

Access Time-Max

0.45 ns

Clock Frequency-Max (fCLK)

333 MHz

Number of Words

33554432 words

Number of Words Code

32000000

Operating Temperature-Max

125 °C

Operating Temperature-Min

-55 °C

Package Body Material

PLASTIC/EPOXY

Package Code

BGA

Package Equivalence Code

BGA208,11X19,40

Package Shape

RECTANGULAR

Package Style

网格排列

Supply Voltage-Nom (Vsup)

1.8 V

端子位置

BOTTOM

终端形式

BALL

端子间距

1 mm

Reach合规守则

compliant

JESD-30代码

R-PBGA-B208

资历状况

不合格

电源

1.8 V

温度等级

MILITARY

电源电流-最大值

1.7 mA

组织结构

32MX72

输出特性

3-STATE

内存宽度

72

待机电流-最大值

0.035 A

记忆密度

2415919104 bit

I/O类型

COMMON

内存IC类型

DDR内存模块

刷新周期

8192