Microsemi Corporation A1425A-PG133B

表面安装

NO

终端数量

133

Supply Voltage-Nom

5 V

Supply Voltage-Min

4.5 V

Supply Voltage-Max

5.5 V

Package Style

GRID ARRAY, HEAT SINK/SLUG

Package Shape

SQUARE

Package Code

HPGA

Package Body Material

CERAMIC, METAL-SEALED COFIRED

Operating Temperature-Min

-55 °C

Operating Temperature-Max

125 °C

Clock Frequency-Max

125 MHz

Package Description

HERMETIC SEALED, CERAMIC, PGA-133

Ihs Manufacturer

MICROSEMI CORP

Part Life Cycle Code

Obsolete

Rohs Code

无

ECCN 代码

3A001.A.2.C

HTS代码

8542.39.00.01

端子位置

PERPENDICULAR

终端形式

PIN/PEG

端子间距

2.54 mm

Reach合规守则

unknown

JESD-30代码

S-CPGA-P133

温度等级

MILITARY

组织结构

310 CLBS, 2500 GATES

座位高度-最大

8.13 mm

可编程逻辑类型

现场可编程门阵列

筛选水平

MIL-STD-883

CLB-Max的组合延时

3 ns

逻辑块数量

310

等效门数

2500

宽度

34.544 mm

长度

34.544 mm