Microsemi Corporation W3H32M72E-400SBM

表面安装

YES

材料

synthetic polyolefin

终端数量

208

Diameter of protected wire (cable)

5.2…9.0 mm

Diameter before shrinkage

10.5 mm

Diameter after shrinkage

5.0 mm

Wall thickness before shrinkage

0.3 mm

Wall thickness after shrinkage

0.6 mm

Gross weight

1245.00

Transport packaging size/quantity

46*46*50/10

Part Life Cycle Code

Transferred

Ihs Manufacturer

MICROSEMI CORP

Package Description

BGA, BGA208,11X19,40

Access Time-Max

0.6 ns

Clock Frequency-Max (fCLK)

200 MHz

Number of Words

33554432 words

Number of Words Code

32000000

Operating Temperature-Max

125 °C

Operating Temperature-Min

-55 °C

Package Body Material

PLASTIC/EPOXY

Package Code

BGA

Package Equivalence Code

BGA208,11X19,40

Package Shape

RECTANGULAR

Package Style

网格排列

Supply Voltage-Nom (Vsup)

1.8 V

包装

spool 100 m

ECCN 代码

EAR99

类型

Heat shrink tubing without adhesive

颜色

black

HTS代码

8542.32.00.36

端子位置

BOTTOM

终端形式

BALL

端子间距

1 mm

Reach合规守则

compliant

JESD-30代码

R-PBGA-B208

资历状况

不合格

Working voltage

600 V

温度等级

MILITARY

电源电流-最大值

1.7 mA

组织结构

32MX72

输出特性

3-STATE

内存宽度

72

Operating temperature range

-55…+125 °C

待机电流-最大值

0.035 A

记忆密度

2415919104 bit

I/O类型

COMMON

内存IC类型

DDR内存模块

Shrink temperature

+70…+120 °C

刷新周期

8192

Shrink ratio

2 : 1