Microsemi FPGA & SoC A3P1000-FG484M

表面安装

YES

Housing material

ABS塑料

终端数量

484

Transport packaging size/quantity

48*32*27/200

Noal resistance

NCmin

Detection distance

0.4 cm

Protection class

IP67

Part Life Cycle Code

Transferred

Ihs Manufacturer

MICROSEMI SOC PRODUCTS GROUP

Part Package Code

BGA

Package Description

BGA,

Package Body Material

PLASTIC/EPOXY

Package Code

BGA

Package Shape

SQUARE

Package Style

网格排列

Supply Voltage-Max

1.575 V

Supply Voltage-Min

1.425 V

Supply Voltage-Nom

1.5 V

Type of capacitor

ceramic

Kind of capacitor

MLCC

Capacitance tolerance

±0.05pF

Mounting

SMD

Case - inch

0201

Case - mm

0603

Capacitors series

GCQ

Gross weight

0.03 g

Operating temperature

-55...125°C

JESD-609代码

e0

端子表面处理

锡铅

HTS代码

8542.39.00.01

电容量

6.7pF

端子位置

BOTTOM

终端形式

BALL

端子间距

1 mm

Reach合规守则

unknown

引脚数量

484

JESD-30代码

S-PBGA-B484

Output type

NPN

电介质

C0G (NP0)

Cable length

1100 mm

组织结构

24576 CLBS, 1000000 GATES

座位高度-最大

2.44 mm

可编程逻辑类型

现场可编程门阵列

逻辑块数量

24576

等效门数

1000000

饱和电流

3

Operating voltage

50V

高度

18 mm

长度

23 mm

宽度

23 mm