Microsemi ZARLINK MD74HCT574RE

表面安装

NO

终端数量

20

Ihs Manufacturer

ZARLINK SEMICONDUCTOR INC

Manufacturer

Microsemi Corporation

Manufacturer Part Number

MD74HCT574RE

Operating Temperature-Max

85 °C

Operating Temperature-Min

-40 °C

Package Body Material

PLASTIC/EPOXY

Package Code

DIP

Package Description

DIP, DIP20,.3

Package Equivalence Code

DIP20,.3

Package Shape

RECTANGULAR

Package Style

IN-LINE

Part Life Cycle Code

Obsolete

Risk Rank

5.92

Rohs Code

无

Supply Voltage-Nom (Vsup)

5 V

JESD-609代码

e0

端子表面处理

Tin/Lead (Sn/Pb)

子类别

FF/Latches

技术

CMOS

端子位置

DUAL

终端形式

THROUGH-HOLE

功能数量

8

端子间距

2.54 mm

Reach合规守则

unknown

JESD-30代码

R-PDIP-T20

资历状况

不合格

电源

5 V

温度等级

INDUSTRIAL

输出特性

3-STATE

逻辑IC类型

D FLIP-FLOP

最大 I(ol)

0.012 A

触发器类型

积极优势