Mitsubishi Electric RD09MUP2

表面安装

YES

Contact plating

gold-plated

Number of pins

30

终端数量

4

晶体管元件材料

SILICON

外壳材料

1

Rohs Code

无

Part Life Cycle Code

活跃

Ihs Manufacturer

MITSUBISHI ELECTRIC CORP

Package Description

FLATPACK, R-XQFP-F4

Drain Current-Max (ID)

4 A

Operating Temperature-Max

150 °C

Package Body Material

UNSPECIFIED

Package Shape

RECTANGULAR

Package Style

FLATPACK

Type of connector

pin strips

Connector

socket

Kind of connector

female

Spatial orientation

straight

Contacts pitch

2.54mm

Electrical mounting

SMT

Connector pinout layout

2x15

Row pitch

2.54mm

Gross weight

1.69 g

Operating temperature

-40...163°C

JESD-609代码

e4

无铅代码

无

ECCN 代码

EAR99

端子表面处理

SILVER

端子位置

QUAD

终端形式

FLAT

Reach合规守则

unknown

Current rating

1.5A

引脚数量

4

JESD-30代码

R-XQFP-F4

资历状况

不合格

配置

SINGLE WITH BUILT-IN DIODE

操作模式

增强型MOSFET

箱体转运

SOURCE

晶体管应用

AMPLIFIER

极性/通道类型

N-CHANNEL

DS 击穿电压-最小值

40 V

场效应管技术

METAL-OXIDE SEMICONDUCTOR

最大耗散功率(Abs)

83 W

Rated voltage

60V

最高频段

超高频段

个人资料

beryllium copper

饱和电流

1

Plating thickness

0.254µm

Flammability rating

UL94V-0