Molex 54S00/B2A

表面安装

YES

终端数量

20

Manufacturer Part Number

54S00/B2A

Rohs Code

无

Part Life Cycle Code

Transferred

Ihs Manufacturer

飞利浦半导体

Package Description

QCCN, LCC20,.35SQ

Risk Rank

5.85

Operating Temperature-Max

125 °C

Operating Temperature-Min

-55 °C

Package Body Material

CERAMIC

Package Code

QCCN

Package Equivalence Code

LCC20,.35SQ

Package Shape

SQUARE

Package Style

CHIP CARRIER

Supply Voltage-Nom (Vsup)

5 V

Usage Level

Military grade

JESD-609代码

e0

端子表面处理

Tin/Lead (Sn/Pb)

端子位置

QUAD

终端形式

无铅

端子间距

1.27 mm

Reach合规守则

unknown

JESD-30代码

S-XQCC-N20

资历状况

不合格

电源

5 V

温度等级

MILITARY

逻辑IC类型

NAND GATE

筛选水平

38535Q/M;38534H;883B

施密特触发器

NO