Mospec Semiconductor Corp F16C20C

表面安装

NO

材料

polyolefin

二极管元件材料

SILICON

终端数量

3

外壳材料

2

Type of capacitor

ceramic

Kind of capacitor

MLCC

Mounting

SMD

Case - inch

1206

Case - mm

3216

Capacitors series

KGM

Gross weight

8.30

Transport packaging size/quantity

103*26*25/1000

Diameter before shrinkage

3 mm

Diameter after shrinkage

1 mm

Wall thickness before shrinkage

0.42 mm

Part Life Cycle Code

接触制造商

Ihs Manufacturer

MOSPEC SEMICONDUCTOR CORP

Package Description

R-PSFM-T3

Forward Voltage-Max (VF)

1.3 V

Operating Temperature-Max

150 °C

Operating Temperature-Min

-65 °C

Package Body Material

PLASTIC/EPOXY

Package Shape

RECTANGULAR

Package Style

FLANGE MOUNT

Operating temperature

-55...125°C

包装

delivered in packs in multiples of 1.0 m

容差

±1%

ECCN 代码

EAR99

类型

Heat shrink tubing with adhesive layer

颜色

white

附加功能

自由旋转二极管

HTS代码

8541.10.00.80

电容量

0.47nF

端子位置

SINGLE

终端形式

THROUGH-HOLE

Reach合规守则

unknown

JESD-30代码

R-PSFM-T3

电介质

C0G (NP0)

Working voltage

≤1500 V

配置

COMMON CATHODE, 2 ELEMENTS

注意

Diameter deviation up to shrinkage up to +1.5 mm is possible

二极管类型

接收电极

箱体转运

CATHODE

输出电流-最大值

8 A

相位的数量

1

Operating temperature range

-55…+125 deg. C

Rep Pk反向电压-最大值

200 V

JEDEC-95代码

TO-220AB

最大非代表Pk前进电流

150 A

反向电流-最大值

10 μA

Shrink temperature

100 deg. C

反向恢复时间-最大值

0.15 μs

第二个连接器加载的位置数

EFFICIENCY

Operating voltage

500V

Shrink ratio

3 : 1

长度

1000 mm