MOTOROLA MC3003P

表面安装

NO

终端数量

14

Package Style

IN-LINE

Package Shape

RECTANGULAR

Package Equivalence Code

DIP14,.3

Package Code

DIP

Package Body Material

PLASTIC/EPOXY

Operating Temperature-Max

70 °C

Risk Rank

5.92

Package Description

DIP, DIP14,.3

Ihs Manufacturer

MOTOROLA SEMICONDUCTOR PRODUCTS

Part Life Cycle Code

Obsolete

Rohs Code

无

Manufacturer Part Number

MC3003P

JESD-609代码

e0

端子表面处理

Tin/Lead (Sn/Pb)

端子位置

DUAL

终端形式

THROUGH-HOLE

端子间距

2.54 mm

Reach合规守则

unknown

JESD-30代码

R-PDIP-T14

资历状况

不合格

温度等级

COMMERCIAL

逻辑IC类型

OR GATE

施密特触发器

NO