MOTOROLA XPC107ARX66L

表面安装

YES

终端数量

503

Package Shape

SQUARE

Package Style

网格排列

Package Equivalence Code

BGA503,25X25,50

Package Code

BGA

Package Body Material

CERAMIC

Risk Rank

5.92

Package Description

BGA, BGA503,25X25,50

Ihs Manufacturer

MOTOROLA INC

Part Life Cycle Code

Obsolete

Rohs Code

无

Manufacturer Part Number

XPC107ARX66L

JESD-609代码

e0

端子表面处理

Tin/Lead (Sn/Pb)

端子位置

BOTTOM

终端形式

BALL

端子间距

1.27 mm

Reach合规守则

unknown

JESD-30代码

S-XBGA-B503

资历状况

不合格

电源

2.5,2.5/3.3,3.3 V