Motorola Semiconductor Products XPC8240LZU200E

表面安装

YES

质量

5.05

终端数量

352

Rohs Code

无

Part Life Cycle Code

Transferred

Ihs Manufacturer

MOTOROLA INC

Package Description

LBGA, BGA352,26X26,50

Clock Frequency-Max

66 MHz

Package Body Material

PLASTIC/EPOXY

Package Code

LBGA

Package Equivalence Code

BGA352,26X26,50

Package Shape

SQUARE

Package Style

GRID ARRAY, LOW PROFILE

Supply Voltage-Max

2.625 V

Supply Voltage-Min

2.375 V

Supply Voltage-Nom

2.5 V

Transport package size/quantity

42*28*18.5/2000

Switching scheme

NC - normally closed contacts

Dielectric strength

at least 800 V

Failure endurance

10000 cycles min

Operating temperature

70 ± 5% °C

ECCN 代码

3A991.A.2

附加功能

ALSO REQUIRES 3.3V I/O SUPPLY

HTS代码

8542.31.00.01

端子位置

BOTTOM

终端形式

BALL

端子间距

1.27 mm

深度

20 mm

Reach合规守则

unknown

JESD-30代码

S-PBGA-B352

资历状况

不合格

Contact resistance

50 mΩ max

Insulation resistance

100 MΩ min

速度

200 MHz

uPs/uCs/外围ICs类型

MICROPROCESSOR, RISC

位元大小

32

座位高度-最大

1.65 mm

地址总线宽度

32

Operating temperature range

20 …+180 (± 3°/ ± 5°) °C

Rated current

16 A

边界扫描

YES

低功率模式

YES

外部数据总线宽度

32

格式

浮点

集成缓存

YES

Reset temperature

50 ± 12% °C

Operating voltage

250 (AC) V

长度

35 mm

高度

4.3 mm

宽度

8.1 mm