Multicomp G5017B11U

表面安装

YES

终端数量

4

Package Description

VFBGA, BGA4,2X2,20

Package Style

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Package Body Material

PLASTIC/EPOXY

Package Equivalence Code

BGA4,2X2,20

Operating Temperature-Min

-40 °C

Supply Voltage-Min

1 V

Operating Temperature-Max

85 °C

Manufacturer Part Number

G5017B11U

Package Code

VFBGA

Package Shape

SQUARE

Manufacturer

Global Mixed-Mode Technology Inc

Part Life Cycle Code

接触制造商

Ihs Manufacturer

GLOBAL MIXED-MODE TECHNOLOGY INC

Supply Voltage-Max

3.6 V

Risk Rank

5.75

端子位置

BOTTOM

终端形式

BALL

功能数量

1

Reach合规守则

compliant

JESD-30代码

S-PBGA-B4

温度等级

INDUSTRIAL

接口IC类型

基于缓冲器或反相器的外设驱动器

驱动程序位数

1