Multicomp MC3523U

表面安装

NO

终端数量

8

Risk Rank

8.8

Ihs Manufacturer

MOTOROLA INC

Part Life Cycle Code

Obsolete

Manufacturer

摩托罗拉半导体产品

Package Shape

RECTANGULAR

Package Code

DIP

Manufacturer Part Number

MC3523U

Rohs Code

无

Operating Temperature-Max

125 °C

Operating Temperature-Min

-55 °C

Package Equivalence Code

DIP8,.3

Package Body Material

CERAMIC

Package Style

IN-LINE

Package Description

DIP, DIP8,.3

JESD-609代码

e0

端子表面处理

Tin/Lead (Sn/Pb)

子类别

电源管理电路

技术

BIPOLAR

端子位置

DUAL

终端形式

THROUGH-HOLE

端子间距

2.54 mm

Reach合规守则

unknown

JESD-30代码

R-XDIP-T8

资历状况

不合格

温度等级

MILITARY