Multicomp MCSH31B104K100CT

包装/外壳

1206

终端数量

2

Product Depth (mm)

1.6(mm)

Wire Form

不需要

Operating Temp Range

-55C to 125C

Case Style

陶瓷芯片

Product Diameter (mm)

Not Required(mm)

Mounting Styles

表面贴装

Temp Coeff (Dielectric)

X7R

Lead Diameter (nom)

Not Required(mm)

Tolerance (+ or -)

10%

Rad Hardened

无

Microwave Application

NO

Seated Plane Height

Not Required(mm)

MSL

-

Qualification

-

Capacitance Tolerance

± 10%

包装

卷带

电容量

100000PF(pF)

结构

SMT 芯片

终端样式

PAD

失败率

不需要

电压

10VDC

产品长度

3.2mm

产品宽度

1.6mm

产品长度(mm)

3.2(mm)