National Semiconductor 54F189FLQB

表面安装

YES

终端数量

16

厂商

National Semiconductor

Product Status

活跃

Package

Bulk

Package Description

CERPACK-16

Package Style

FLATPACK

Number of Words Code

16

Package Body Material

CERAMIC, GLASS-SEALED

Operating Temperature-Min

-55 °C

Access Time-Max

32 ns

Operating Temperature-Max

125 °C

Manufacturer Part Number

54F189FLQB

Number of Words

16 words

Supply Voltage-Nom (Vsup)

5 V

Package Code

DFP

Package Shape

RECTANGULAR

Manufacturer

Rochester Electronics LLC

Part Life Cycle Code

活跃

Ihs Manufacturer

ROCHESTER ELECTRONICS LLC

Risk Rank

5.79

Part Package Code

DFP

系列

*

端子位置

DUAL

终端形式

FLAT

功能数量

1

端子间距

1.27 mm

Reach合规守则

unknown

引脚数量

16

JESD-30代码

R-GDFP-F16

资历状况

COMMERCIAL

电源电压-最大值(Vsup)

5.5 V

温度等级

MILITARY

电源电压-最小值(Vsup)

4.5 V

操作模式

ASYNCHRONOUS

组织结构

16X4

座位高度-最大

2.032 mm

内存宽度

4

记忆密度

64 bit

并行/串行

PARALLEL

内存IC类型

标准SRAM

宽度

6.604 mm

长度

9.6645 mm