National Semiconductor CD4001BMJ-MIL

表面安装

NO

终端数量

14

Manufacturer Part Number

CD4001BMJ-MIL

Rohs Code

无

Part Life Cycle Code

Obsolete

Package Style

IN-LINE

Package Shape

RECTANGULAR

Package Equivalence Code

DIP14,.3

Package Code

DIP

Package Body Material

CERAMIC

Operating Temperature-Min

-55 °C

Operating Temperature-Max

125 °C

Risk Rank

8.8

Ihs Manufacturer

NATIONAL SEMICONDUCTOR CORP

Usage Level

Military grade

JESD-609代码

e0

端子表面处理

Tin/Lead (Sn/Pb)

端子位置

DUAL

终端形式

THROUGH-HOLE

端子间距

2.54 mm

Reach合规守则

compliant

JESD-30代码

R-XDIP-T14

资历状况

不合格

电源

5/15 V

温度等级

MILITARY

逻辑IC类型

NOR GATE

筛选水平

MIL-STD-883 Class B (Modified)

施密特触发器

NO