National Semiconductor CD4013BMJ/883C

表面安装

NO

终端数量

14

RoHS

有

Package Style

IN-LINE

Package Body Material

CERAMIC

Package Equivalence Code

DIP14,.3

Operating Temperature-Min

-55 °C

Operating Temperature-Max

125 °C

Rohs Code

无

Manufacturer Part Number

CD4013BMJ/883C

Package Code

DIP

Package Shape

RECTANGULAR

Manufacturer

National Semiconductor Corporation

Part Life Cycle Code

Obsolete

Ihs Manufacturer

NATIONAL SEMICONDUCTOR CORP

Risk Rank

5.86

Prop.

350 ns

Usage Level

Military grade

JESD-609代码

e0

端子表面处理

Tin/Lead (Sn/Pb)

子类别

FF/Latches

技术

CMOS

端子位置

DUAL

终端形式

THROUGH-HOLE

功能数量

2

端子间距

2.54 mm

Reach合规守则

unknown

JESD-30代码

R-XDIP-T14

资历状况

不合格

电源

5/15 V

温度等级

MILITARY

比特数

1

家人

4000/14000/40000

输出极性

COMPLEMENTARY

逻辑IC类型

D FLIP-FLOP

筛选水平

MIL-STD-883 Class C

触发器类型

积极优势