National Semiconductor CD4514BMJ/883B

表面安装

NO

终端数量

24

Package Style

IN-LINE

Package Body Material

CERAMIC

Package Equivalence Code

DIP24,.6

Operating Temperature-Min

-55 °C

Operating Temperature-Max

125 °C

Rohs Code

无

Manufacturer Part Number

CD4514BMJ/883B

Package Code

DIP

Package Shape

RECTANGULAR

Manufacturer

National Semiconductor Corporation

Part Life Cycle Code

Obsolete

Ihs Manufacturer

NATIONAL SEMICONDUCTOR CORP

Risk Rank

8.79

Usage Level

Military grade

JESD-609代码

e0

端子表面处理

Tin/Lead (Sn/Pb)

子类别

Decoder/Drivers

技术

CMOS

端子位置

DUAL

终端形式

THROUGH-HOLE

功能数量

1

端子间距

2.54 mm

Reach合规守则

compliant

JESD-30代码

R-XDIP-T24

资历状况

不合格

电源

5/15 V

温度等级

MILITARY

逻辑IC类型

OTHER DECODER/DRIVER

筛选水平

38535Q/M;38534H;883B