National Semiconductor DM5472J/883B

表面安装

NO

终端数量

14

Package Description

DIP, DIP14,.3

Package Style

IN-LINE

Package Body Material

CERAMIC

Package Equivalence Code

DIP14,.3

Operating Temperature-Min

-55 °C

Operating Temperature-Max

125 °C

Rohs Code

无

Manufacturer Part Number

DM5472J/883B

Package Code

DIP

Package Shape

RECTANGULAR

Manufacturer

Texas

Part Life Cycle Code

Obsolete

Ihs Manufacturer

NATIONAL SEMICONDUCTOR CORP

Risk Rank

5.92

Prop.

40 ns

Usage Level

Military grade

JESD-609代码

e0

端子表面处理

Tin/Lead (Sn/Pb)

子类别

FF/Latches

技术

TTL

端子位置

DUAL

终端形式

THROUGH-HOLE

功能数量

1

端子间距

2.54 mm

Reach合规守则

unknown

JESD-30代码

R-XDIP-T14

资历状况

不合格

温度等级

MILITARY

逻辑IC类型

J-K FLIP-FLOP

最大 I(ol)

0.016 A

筛选水平

38535Q/M;38534H;883B

触发器类型

MASTER-SLAVE