National Semiconductor LM3555TLX

表面安装

YES

终端数量

12

Package Description

2.10 X 1.575 MM, 0.60 MM HEIGHT, 0.50 MM PITCH, MICRO, SMD-12

Package Style

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Moisture Sensitivity Levels

1

Package Body Material

PLASTIC/EPOXY

Operating Temperature-Min

-30 °C

Supply Voltage-Nom

3.6 V

Supply Voltage-Min

2.5 V

Operating Temperature-Max

85 °C

Rohs Code

有

Manufacturer Part Number

LM3555TLX

Package Code

VFBGA

Package Shape

SQUARE

Manufacturer

Texas

Part Life Cycle Code

Obsolete

Ihs Manufacturer

Texas INC

Supply Voltage-Max

5.5 V

Risk Rank

5.7

Part Package Code

BGA

JESD-609代码

e1

ECCN 代码

EAR99

端子表面处理

Tin/Silver/Copper (Sn/Ag/Cu)

附加功能

SEATED HGT-NOM

HTS代码

8542.39.00.01

端子位置

BOTTOM

终端形式

BALL

功能数量

1

端子间距

0.5 mm

Reach合规守则

compliant

引脚数量

12

JESD-30代码

S-PBGA-B12

温度等级

OTHER

座位高度-最大

0.6 mm

接口IC类型

LED显示驱动

fmax-Min

0.4 MHz

分段数

2

多路显示功能

NO

宽度

1.575 mm

长度

2.1 mm