National Semiconductor LP5552TL

表面安装

YES

终端数量

36

Package Description

FBGA, BGA36,6X6,20

Package Style

GRID ARRAY, FINE PITCH

Moisture Sensitivity Levels

1

Package Body Material

PLASTIC/EPOXY

Package Equivalence Code

BGA36,6X6,20

Operating Temperature-Min

-40 °C

Operating Temperature-Max

85 °C

Rohs Code

有

Manufacturer Part Number

LP5552TL

Package Code

FBGA

Package Shape

SQUARE

Manufacturer

Texas

Part Life Cycle Code

Obsolete

Ihs Manufacturer

NATIONAL SEMICONDUCTOR CORP

Risk Rank

5.84

JESD-609代码

e1

端子表面处理

Tin/Silver/Copper (Sn/Ag/Cu)

子类别

电源管理电路

端子位置

BOTTOM

终端形式

BALL

端子间距

0.5 mm

Reach合规守则

compliant

JESD-30代码

S-PBGA-B36

资历状况

不合格

电源

3/4.5 V

温度等级

INDUSTRIAL