National Semiconductor MM1101A2N

表面安装

NO

终端数量

16

Manufacturer Part Number

MM1101A2N

Rohs Code

无

Part Life Cycle Code

Obsolete

Ihs Manufacturer

NATIONAL SEMICONDUCTOR CORP

Package Description

DIP, DIP16,.3

Risk Rank

5.91

Access Time-Max

500 ns

Number of Words

256 words

Number of Words Code

256

Operating Temperature-Max

70 °C

Operating Temperature-Min

-25 °C

Package Body Material

PLASTIC/EPOXY

Package Code

DIP

Package Equivalence Code

DIP16,.3

Package Shape

RECTANGULAR

Package Style

IN-LINE

JESD-609代码

e0

端子表面处理

Tin/Lead (Sn/Pb)

端子位置

DUAL

终端形式

THROUGH-HOLE

端子间距

2.54 mm

Reach合规守则

unknown

JESD-30代码

R-PDIP-T16

资历状况

不合格

温度等级

OTHER

操作模式

ASYNCHRONOUS

组织结构

256X1

输出特性

3-STATE

内存宽度

1

并行/串行

PARALLEL

内存IC类型

标准SRAM